The K24V3, a new-generation high-density multi-node server, supports both Intel and AMD platforms. Featuring compatibility with 3 types of single-socket/dual-socket compute nodes, it is tailored for high-performance computing optimization. The dual-socket configuration accommodates both air cooling and liquid cooling, with cold plates covering CPUs, DIMMs, and VR within a node. This approach achieves a high liquid cooling ratio, effectively reducing system power consumption and operating noise, and meeting the low PUE demand, assisting customers in building a new generation of green high-density data centers.
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The K24V3, a new-generation high-density multi-node server, supports both Intel and AMD platforms. Featuring compatibility with 3 types of single-socket/dual-socket compute nodes, it is tailored for high-performance computing optimization. The dual-socket configuration accommodates both air cooling and liquid cooling, with cold plates covering CPUs, DIMMs, and VR within a node. This approach achieves a high liquid cooling ratio, effectively reducing system power consumption and operating noise, and meeting the low PUE demand, assisting customers in building a new generation of green high-density data centers.
